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Influence of double bonds and cyclic structure on the AP‐PECVD of low‐k organosilicon insulating layers
Influence of double bonds and cyclic structure on the AP‐PECVD of low‐k organosilicon insulating layers
2021
Dominique Abessolo Ondo
François Loyer
Nicolas D. Boscher
Keywords:
Materials science
Organosilicon
Low-k dielectric
Dielectric barrier discharge
Analytical chemistry
Double bond
Atmospheric-pressure plasma
Plasma-enhanced chemical vapor deposition
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