Integrated LED device and preparing method thereof

2016 
The invention provides an integrated LED device and preparing method thereof. The device comprises several LED chips. The LED chip contains N type semiconductor layer, multiple quantum well luminous layer, P type semiconductor layer, N electrode and P electrode. The N electrode connects N type semiconductor layer electrically, and the P electrode connects P type semiconductor layer electrically. The graphical substrate is used for carrying the LED chips and comprises several primary interconnected areas and secondary interconnected areas. The N electrode and P electrode in the LED chips respectively connect the primary interconnected areas and secondary interconnected areas in the graphical substrate electrically. The device connects the LED chips and graphical substrate electrically with simple structure and manufacturing technology improving the reliability of device and realizing the large power and high current.
    • Correction
    • Source
    • Cite
    • Save
    • Machine Reading By IdeaReader
    0
    References
    0
    Citations
    NaN
    KQI
    []