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Material Removal Mechanism during Copper Chemical Mechanical Planarization Based on Nano-Scale Material Behavior
Material Removal Mechanism during Copper Chemical Mechanical Planarization Based on Nano-Scale Material Behavior
2017
Seungchoun Choi
Fiona M. Doyle
David Dornfeld
Keywords:
Copper
Chemical-mechanical planarization
Nanoscopic scale
Inorganic chemistry
Chemistry
Metallurgy
material removal
Correction
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