Fabrication process for a flexible tag microlab
2007
The aim of this paper is to present an integrated process flow for a smart tag with integrated sensors and RFID
communication, a Flexible Tag Microlab (FTM). The heart of the designed container tracing system is an RFID system
(Reader + Tag) with gas sensing capabilities on board. In the former prototypes, the chemical sensors were integrated on
the reader, whereas the tags where addressed like conventional RFID-tags containing also physical (temperature,
humidity and light) sensors. However, this paper will show how the gas sensing reader functionalities are being
transferred to the tag, reaching a flexible tag microlab, which represents a real innovation in the field of flexible labels.
Key issues for the realisation of the FTM, such us flexible substrates and gas sensor integration technologies will be
presented.
The process flow employed for the two metal levels interconnect fabrication will be described in detail. The material
used is the DuPont TM Pyralux (R) AP 8525R double-sided copper-clad laminate, formed by a Kapton foil with a copper
layer on each side. The vias and windows openings are performed by femtosecond laser ablation. The copper
interconnections are realized by photolithography and wet chemical etching.
The MOX sensors hotplates specially developed to fulfil the FTM constrains in terms of low power consumption has
been used to prove two integration technologies into the flexible substrates: Chip on Flex (COF) wire bonding and
Anisotropic Conductive Adhesive (ACA) flip chip bonding. Both technologies will be compared and benchmarked for
future product developments.
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