Old Web
English
Sign In
Acemap
>
Paper
>
Wafer Bonding for MEMS Vacuum Packaging
Wafer Bonding for MEMS Vacuum Packaging
2014
Viorel Dragoi
Eric Pabo
Keywords:
Wafer bonding
Microelectromechanical systems
Vacuum packing
Materials science
Composite material
Optoelectronics
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
1
Citations
NaN
KQI
[]