Holding jig of the thin plate

PROBLEM TO BE SOLVED: To provide a holding jig of a thin plate capable of easily peeling a thin plate having heat resistance, e.g., a sticking semiconductor chip or semiconductor wafer, even after it has been introduced into the solder reflow, and capable of repeating these works.SOLUTION: A holding jig of a thin plate has a carrier 10, and an adhesive film 13 covering the surface of the carrier 10 and bonded at least to the periphery of the carrier 10. The adhesive film 13 has a film substrate 13B, a first adhesive layer 131 formed on the surface of the film substrate 13B opposite from the carrier 10, and containing a filler, and a second adhesive layer 132 formed on the surface of the film substrate 13B on the carrier 10 side, and containing a filler. Content of the filler in the first adhesive layer 131 is smaller than that in the second adhesive layer 132, and content of the filler in the first adhesive layer 131 is in the range of 1.0-2.5 wt% for the solid content in the first adhesive layer 131 other than the filler.