THE ADVANTAGES OF EVAPORATION IN MICRO-SCALE CHANNELS TO COOL MICROELETRONIC DEVICES

In this paper, the importance of the development of new high power density thermal management systems for electronic devices is assessed. It is described the new heat sink technologies under development to be used in the cooling of microprocessors. The main difficulties to be overcome before the spreading of one specific heat sink configuration are identified. At the end, it is concluded that a heat sink based on flow boiling in micro-scale channels is the most promising approach.