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A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer
A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer
2018
Yang Xu
Shengkai Wang
Ying-Hui Wang
Dapeng Chen
Keywords:
Thermocompression bonding
Physics
Adhesive
Anodic bonding
Wafer bonding
Metallurgy
Pressing
Correction
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