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Actively Aligned Flip-Chip Integration of InP to SiN Utilizing Optical Backscatter Reflectometry
Actively Aligned Flip-Chip Integration of InP to SiN Utilizing Optical Backscatter Reflectometry
2019
Michael Theurer
Martin Moehrle
A. Sigmund
K.-O. Velthaus
Ruud Oldenbeuving
Lennart Wevers
F.M. Postma
Richard Mateman
F. Schreuder
Dimitri Geskus
Kerstin Worhoff
Ronald Dekker
Rene Gerrit Heideman
Martin Schell
Keywords:
Reflectometry
Backscatter
Engineering
Flip chip
Optics
Correction
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