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300mm Cu BEOL Top Trench Etch Process Development for 65nm Logic Technology
300mm Cu BEOL Top Trench Etch Process Development for 65nm Logic Technology
2010
Wei Ren
Jeff Song
Andrew Liu
Ganming Zhao
Ying Huang
Peter Hsieh
Binxi Gu
Judy Wang
Keywords:
Electronic engineering
Trench
Materials science
Engineering physics
process development
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