Organic light emitting diode packaging structure and manufacturing method therefor

The invention provides an organic light emitting diode packaging structure and a manufacturing method therefor. The organic light emitting diode packaging structure comprises a cover plate, an array substrate, a sealant and an interval layer, wherein the array substrate is arranged opposite to the cover plate; the sealant is arranged between the cover plate and the array substrate; and the interval layer is arranged on the surface, which faces the sealant, of the array substrate, and/or the surface, which faces the sealant, of the cover plate, and is combined with the sealant, wherein the combination surface between the interval layer and the sealant adopts an uneven structure. By virtue of the organic light emitting diode packaging structure and the manufacturing method therefor provided by the invention, the packaging compactness can be improved, water oxygen entering difficulty is improved, and increasing of the width of the sealant is not needed.