Low-temperature deposition of ultrathin SiO2 films on Si substrates

We present a detailed investigation of the properties of silicon dioxide deposited at a low temperature. The advantages of this process include its low thermal requirements (about 200 °C), the absence of corrosive by-products and the lack of need of vacuum equipment. Sol solutions were prepared for the deposition of ultrathin SiO2 films by spin-coating at the low annealing temperature of 200 °C. The layers' thickness was 24 nm and 5 nm. We describe in detail the material properties of this novel low-temperature SiO2 layers obtained by extensive characterization using Fourier transform infrared spectroscopy (FTIR), atomic force microscopy (AFM), XPS spectroscopy, capacitance-voltage (C-V) and current-voltage (I-V) measurements. The ultrathin oxide layers on Si substrates show good dielectric properties.