Surface treated copper foil, copper-clad laminate, a printed wiring board, method of manufacturing the electronic device and the printed circuit board

Good adhesion with the resin, and, when observed in the resin over, to provide a surface treated copper foil for superior visibility. A one surface and the other surface treated copper foil surface treatment is performed respectively on the surface, and the surface-treated copper foil and a polyimide previous following .DELTA.B (PI) is 50 or more 65 or less laminated on the copper foil in laminated to copper-clad laminate constituted color difference Delta] E * ab based on JIS Z8730 of polyimide over the surface is 50 or more. Copper foil, when taken with the CCD camera in the polyimide over the surface treatment was laminated from the surface side that has been done, observation spot - in lightness graph, ΔB (ΔB = Bt-Bb) is 40 or more. Ten-point average roughness Rz of the TD to the wavelength of the laser beam of the other surface treatment copper foil surface of the surface treated copper foil was measured by a laser microscope is 405nm is at 0.35μm or more.