Light emitting diode chip and production method thereof

The invention provides a light emitting diode chip and a production method of the light emitting diode chip. The light emitting diode chip and production method of the light emitting diode chip comprise a growing substrate. More than two light emitting diode units are formed on the growing substrate. Each two adjacent light emitting diode units are separated by a deep groove. Non-metal wires are coated on the deep grooves. Two adjacent light emitting diode units are connected in series or in parallel through the non-metal wires. Metal electrode bonding pad is formed on a light emitting diode unit which is on the outmost periphery of the light emitting diode chip. The non-metal wires are adopted by the light emitting diode chip as an interconnecting structure among the light emitting diode units. Compared with metal wires which are high in thickness and poor in light-admitting quality, the non-metal wires are better in light-admitting quality and relatively thinner. When the light emitting diode chip is driven by high pressure, failure of the chip caused by fusing at the corner of a step is not prone to occur. Effective bright dipping area is enlarged and stability of the light emitting diode chip is improved.