High accelerated lifetime test methods and procedures for VLSI microcircuit interconnection line certification
1991
As an outcome of the advances in integrated circuit fabrication technology, electromigration has become a major reliability concern in silicon VLSI circuits. This paper represents an innovative testing approach, that allows a substantial reduction in the electromigration test times of metal thin films, and can be implemented as an in-line process electromigration monitor. >
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
16
References
1
Citations
NaN
KQI