Processing the composite to a substrate

Composite comprising 1.1 a substrate as Dunnstsubstrat (2) is formed with a thickness of less than 0.3 mm; 1.2 a carrier substrate (1); 1.3 wherein the substrate is at least indirectly with the carrier substrate (1) is connected; 1.4 between the substrate and the carrier substrate (1) a spacer layer (3) having recesses (3.3) is introduced, the recesses (3.3) are provided at least in the surface of the spacer layer (3) which faces the substrate, characterized, in that. 1.5 the composite has a total thickness of 0.4 mm to 1.1 mm, especially a total thickness of 0.5 mm.