A method of manufacturing a display device has led emissive

The invention relates to a method of fabricating an emissive display device LED, comprising the steps of: a) providing a plurality of chips (200) each comprising at least one LED (110) and, on one face of connection, a plurality of hydrophilic electric connection pads (125, 126, 127, 128) and a hydrophobic area (202); b) providing a transfer substrate (250) comprising, for each chip, a plurality of hydrophilic electric connection pads (155, 156, 157, 158) and a hydrophobic area (252); c) disposing a drop of a liquid (260) on each electrical pad of the transfer substrate and / or each chip; and d) setting the chips on the direct bonding by transfer substrate, using the drops capillary restoring force for aligning the electrical pads of the chips on the electrical connection pads of the mounting substrate.