Evolution of Temperature and Solid Slag Film During Solidification of Mold Fluxes

A mathematical model based on one-dimensional transient heat conduction was developed to calculate temperature distribution of slag film during cooling process. Solid slag film was obtained from a water-cooled copper detector, and the evolution of its structure was analyzed according to the calculated results and crystallization behavior of mold fluxes. During formation process of the solid slag film, the cooling rate of liquid slag first increases, and then decreases with time. The maximum value of the cooling rate may exceed 50 K/s. Before the solid slag film is formed, the cooling rate of molten slag on the detector side is much higher than that of slag on the liquid slag side. Experimental results indicate that the thermal history of a cooling process has an effect on the crystallization temperature of mold flux. In addition, variation of temperature can also influence the structure of solid slag film since the increase of temperature inside the slag film may lead to the crystallization of the glassy layer.