Precision cutting of epoxy resin board (ERB) by ultraviolet (UV) nanosecond laser ablation with consideration of hazardous gas protection

Abstract Mechanism and processing technology of ultraviolet (UV) nanosecond laser precision cutting of epoxy resin board (ERB) were investigated based on by-products analysis and orthogonal experiment. Interactions between UV nanosecond laser and ERB was studied, and by-products generated during laser cutting process were analyzed. Among them, gaseous by-products such as CO and benzene were potentially toxic. Under premise of cutting off ERB (0.5 mm thick), minimum seam width (75±3 μm) was obtained at laser cutting parameters combination of 4.04 W - 1000 mm/s – 8 (cutting times). Meanwhile, there was no obvious burr and thermal deformation of the seam. Overall, UV nanosecond laser is a viable process for precision cutting of ERB, but protective measures must be taken during the process.