Protective film structure of metal member, metal component employing protective film structure, and equipment for producing semiconductor or flat-plate display employing protective film structure

Provide an inhibiting reaction product deposited on the inner wall of processing a semiconductor or flat panel display manufacturing apparatus and the like, metal contamination due to corrosion or the like due to the inner wall, a plurality of discharge process as a gas such as instability due to multiple possible system and apparatus for manufacturing a functional film structure of the protection system. Metallic material having on the surface coating layer as a first base layer, and then forming a second film layer of about 200 m, the first oxide film layer having a film thickness of 1μm or less formed by direct oxidation of the base material. With this configuration, the protective film layer 2 having a corrosion resistance to ions and radicals, the oxide film of the first layer serves to prevent diffusion of ions and molecules due to the manipulation of the base metal surface of the second layer protective film the effect of the protective layer by etching, reduction of each metal member, a surface metal contamination of the substrate process chamber caused. Can be suppressed due to corrosion of the base material and the protective film interface due to the second layer second layer protecting film and the release layer adhesion decreased focus the second protective film is caused.