Electronic equipment cooling device capable of distributing fluid equally

The invention relates to an electronic equipment cooling device capable of distributing fluid equally. The electronic equipment cooling device capable of distributing the fluid equally comprises a water cooling mother board and multiple water cooling plugins, wherein the water cooling mother board is arranged in a supporting frame, and the multiple water cooling plugins are inserted in the water cooling mother board. Each water cooling plugin is provided with fluid plugs allowing cooling liquid to flow in and flow out. The water cooling mother board is provided with multiple pairs of fluid sockets corresponding to the fluid plugs of the water cooling plugins. The electronic equipment cooling device capable of distributing the fluid equally is characterized in that two opposite corners of the water cooling mother board are provided with a main water inlet and a main water outlet respectively; one end in the water cooling mother board is provided with a water inlet main pipe communicated with the main water inlet, and the other end in the water cooling mother board is provided with a water outlet main pipe communicated with the main water outlet; multiple water inlet branch pipes communicated with the water inlet main pipe are arranged in the water cooling mother board in parallel and are approximately perpendicular to the water inlet main pipe; multiple water outlet branch pipes communicated with the water outlet main pipe are arranged in the water cooling mother board in parallel and are approximately perpendicular to the water outlet main pipe; the water inlet fluid sockets are arranged on the water inlet branch pipes, and the water outlet fluid sockets are arranged on the water outlet branch pipes. The electronic equipment cooling device is easy to machine, small in flow resistance, uniform in fluid distribution and good in heat dissipation effect.