Solder material and a device or apparatus and manufacturing method thereof using the same

PROBLEM TO BE SOLVED: To provide lead-free solder inexpensively and easily usable for high temperature soldering by using a raw material having general applicability and to provide a device joined and formed by using the same. SOLUTION: This soldering material is a tin-zinc-silver series soldering material in which the weight ratio of tin to zinc is (97:3) to (79:21), and the weight ratio of the total of tin and zinc to silver is (88:12) to (50:50), or a tin-zinc-silver series soldering material in which the weight ratio of tin to zinc is (70:30) to (5:95), and the ratio of silver is <=15 wt.% of the total content of silver, tin and zinc, or a tin base soldering material composed of 0.01 to 2 wt.% germanium and/or aluminum, and the balance tin, or a soldering material in which the weight ratio of tin to zinc is (80:20) to (70:30), by which the electric connection of the device requiring heat resistant operation is formed. Among plural soldering stages, in the former stage, the production of the device is performed by using the above soldering material.