A method for soldering an insulating substrate on a support

The invention relates to a method for soldering an insulating substrate (2) on a substrate mounting portion (32) of a carrier (3) by means of a predetermined solder (4). The insulating substrate (2) comprises a dielectric insulating support (20), a top (2t), and one of the top face (2t) opposite the bottom (2b). In the method, an insulating substrate (2) is selected on the basis of a criterion, is calculated from the inferred that the insulating substrate (2) if this has the solidus temperature of the solder (4), a positive unevenness (UE2) comprises. The selected insulating substrate (2) on its underside (2b) with the substrate mounting portion (32) are soldered, so that the solidified solder (4) after soldering continuously from the bottom (2b) of the insulating substrate (2) to the substrate mounting portion ( 32). The top (2t) of the selected insulating substrate (2) is fitted before or after soldering with at least one semiconductor chip (1).