Mems mems device forming method and device

The present invention discloses a contents comprising a microelectromechanical system (MEMS) device wafer of a MEMS device. The MEMS device comprises a movable element, and a first opening of the MEMS wafer. The movable member disposed in the first opening. Carrier wafer bonded to the MEMS wafer. The wafer carrier includes a second opening connected to the first opening, wherein said opening comprises a second surface of the carrier from the wafer carrier extend into the inlet portion of the wafer, and the ratio of the inlet portion wide inner portion, wherein the inner portion of the inlet portion than the depth of the wafer carrier. The present invention also discloses a micro-electromechanical systems (MEMS) device, and a method of forming a MEMS device.