Water-Glass-Based Thermal Paste for High-Temperature Applications

Inorganic water-glass-based thermal pastes exhibit a higher thermal conductivity coefficient than silicon-based pastes. They can also be used at elevated temperatures. The optimum filler content, silicate modulus, application of a modifier and pressure were studied. As the result, a significant increase in the thermal conductivity at 508 °C could be explained. The MgO-Na 2 O-SiO 2 system with high magnesium oxide content has not been studied adequately, so special attention is paid to this system composition.