Optimization and Numerical Simulation of Microchannels Heat Sink to Cool Chip with High Heat Flux

The requirements to cool chips with high heat flux are firstly analyzed.Optimization design and numerical simulation of microchannels heat sink are then studied.It is shown through the results of optimization that rectangle microchannels heat sink has better thermal transfer performance,the width of channel and fin are 125μm and 50μm,and the corresponding thermal resistance is 8.252K/W.The results of numerical simulation show that the highest temperature of chip is 360.482K,which means that the optimized microchannels heat sink can meet the requirements of the chip with high heat flux.