A method of manufacturing a semiconductor light-emitting device

It is a method of manufacturing a semiconductor light-emitting device (20 '') is provided, the method comprising: preparing a substrate (11) having opposed first and second major surfaces (11a, 11b); Forming a plurality of projecting portions (c) in the first major surface (11a) of the substrate (11); Forming a light-emitting stack (20) on the first major surface (11a) on which the plurality of projecting portions (c) is formed; Forming a plurality of light emitting structures by removing portions of the light emitting stack (20), which are formed in areas corresponding to grooves (g) to the plurality of projecting portions (c); and separating the substrate (11) along the grooves (g).