High mobility strained germanium quantum well field effect transistor as the p-channel device option for low power (Vcc = 0.5 V) III–V CMOS architecture

In this article we demonstrate a Ge p-channel QWFET with scaled TOXE = 14.5A and mobility of 770 cm 2 /V*s at n s =5×10 12 cm −2 (charge density in the state-of-the-art Si transistor channel at Vcc = 0.5V). For thin TOXE < 40 A, this represents the highest hole mobility reported for any Ge device and is 4× higher than state-of-the-art strained silicon. The QWFET architecture achieves high mobility by incorporating biaxial strain and eliminating dopant impurity scattering. The thin TOXE was achieved using a Si cap and a low Dt transistor process, which has a low oxide interface Dit. Parallel conduction in the SiGe buffer was suppressed using a phosphorus junction layer, allowing healthy subthreshold slope in Ge QWFET for the first time. The Ge QWFET achieves an intrinsic Gmsat which is 2× higher than the InSb p-channel QWFET [3]. These results suggest the Ge QWFET is a viable p-channel option for non-silicon CMOS.