AN EHF backplate design for airborne active phased array antennas

An EHF array backplate design for use in airborne active phase array antennas is described. The backplate utilizes a multilayer substrate and reduced waveguide for signal routing, while a counterflow air cooling technique is used to cool the GaAs monolithic microwave integrated circuit (MMIC) active devices. The integrated design is characterized by temperature-coefficient-matched materials to insure a rigid, thermally stable structure. >