Study on preparation of hot-air solder leveling soldering aid

Hot-air solder leveling soldering fluid was made from amphiprotic surface active agent,bright agent,antismoke agent,activating agent and component solvent.In 241～243 ℃,the effect of various component amount on PCB bonding pads which were treated by hot-air solder leveling,the brightness and fullness of lead-tin solder in hole,red-hole and exhaust smoke level were studied.The result showed that:the best composition of soldering fluid were amphiprotic surface active agent is 65%,bright is 6.5%,antismoke agent is 0.9%,activating agent is 0.75%,the rest is solvent.Lead-tin solder on bonding pads and holes was bright and full,no red-hole,low exhaust smoke lever,which can meet the requirement of PCB produce.