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Amorphous Ti-Si-N Diffusion Barrier Layer for Cu Interconnection
Amorphous Ti-Si-N Diffusion Barrier Layer for Cu Interconnection
1995
Tadashi Iijima
Yoshiaki Shimooka
Kyoichi Suguro
Keywords:
Amorphous solid
Interconnection
Inorganic chemistry
Diffusion barrier
Materials science
Chemical engineering
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