Laminated body comprising metal wire layer, and manufacturing method therefor

The present invention relates to a method for manufacturing a flexible substrate in which a metal wire is embedded, and provides a laminated body comprising: a carrier substrate; a debonding layer disposed on at least one surface of the carrier substrate and comprising a polyimide-based resin; a metal wire layer in contact with the debonding layer; and a flexible substrate layer in contact with the metal wire layer. The adhesive force between the metal wire layer and the flexible substrate layer is greater than the adhesive force between the metal wire layer and the debonding layer. Thus, even if a laser irradiation process, a light irradiation process, or the like is not performed, it is possible to easily separate the flexible substrate having the metal wire layer from the carrier substrate. In addition, since a metal wire can be embedded in the flexible substrate layer, the surface resistance of an electrode can be reduced, and even if the shape of a substrate is deformed, it is possible to prevent the metal wire from being damaged or cut as the metal wire is embedded in the substrate.