Linear coefficients of thermal expansion of Au0.5Ni0.5Sn4, Au0.75Ni0.25Sn4, and AuSn4

Abstract Linear coefficients of thermal expansion for Au 1− x Ni x Sn 4 and AuSn 4 alloys have been measured by thermo-mechanical analysis at temperatures between 340 and 460 K. These values are compared to those of other constituents of Ni/Au/PbSn solder joints. These joints have previously been shown to crack during thermal cycling in this temperature range.