The semiconductor mounting substrate resin composition and formed by molding it

And at least a resin composition comprising the following components (A) ~ (E), the epoxy resin (A), comprises a bifunctional epoxy resin 80 to 100 wt%, the total amount of the resin composition 100 wt% with respect to comprise 60 to 85% by weight of (D), the resin composition that is liquid at room temperature is substantially free of solvent. (A) an epoxy resin (B) an amine-based curing agent (C) dimethyl ureido group, an imidazole group, at least one accelerator having a functional group (D) silica particles (E) silane coupling selected from among tertiary amino group excellent curability at coupling agent low temperature, also the linear expansion coefficient after curing is sufficiently small, no warped when applied and molded on a copper thin film, peeling and cracking by bending further the obtained substrate It does not cause the resin composition, and to provide a semiconductor mounting substrate obtained by molding the resin composition.