Resin composition, the resin sheet, a metal foil resin sheet, a resin sheet of the cured product, structure, and a semiconductor device for power or for a light source

The resin composition of the present invention, an epoxy resin containing a polyfunctional epoxy resin, a curing agent containing a novolak resin having a structural unit represented by the following formula (I), an inorganic filler containing nitride particles, containing. In the formula (I), represents a hydrogen atom or a methyl group independently each R1 and R2, m represents 1.5 to 2.5 in average, n represents represents a 1 to 15 as average values.