A highly reliable cleaning process

Soldering is an important process for the production of electronic products. For high-reliability electronic products, various types of pollutants introduced after soldering are unacceptable and must be cleaned to meet their use requirements. With the increase of product assembly density and the wide application of bottom-side soldered components such as BGA, cleaning has become more and more difficult. This article mainly introduces a highly reliable cleaning process - vacuum vapor phase cleaning. The use of vacuum enhances the cleaning ability for fine pitch, invisible bottom surface, and satisfies the cleaning requirements for high density and high reliability electronic products.