Semiconductor package having heat spreader and method of forming the same

PURPOSE: A semiconductor package including a heat spreader and a forming method thereof are provided to improve heat discharge efficiency by forming a second heat spread pattern with a thermal interface material between a semiconductor chip and a first heat spread pattern. CONSTITUTION: A semiconductor chip (41) is mounted on a substrate (21). A first heat spread pattern (29) is mounted on the substrate. The first heat spread pattern includes an opening part to expose the semiconductor chip. A second heat spread pattern (32) is formed between the side of the semiconductor chip and the first heat spread pattern. The second heat spread pattern includes a thermal interface material.