Analysis of advanced technology nodes and h-NA EUV introduction: a cost perspective

The continued need to satisfy the Power-Performance-Area requirements in advanced technologies resulted in a steady and rapid increase in manufacturing costs in the last years. Indeed, novel process integration schemes can require advanced tools and/or new materials, further aggravating cost. In addition, several dimensions are slowing down reaching a plateau due to physical limitations, which can impact the resulting die cost. Therefore, in this work we analyze advanced technology nodes from a cost perspective, considering different patterning and integration schemes at 3 nm and 2 nm node as this is becoming more and more important. Also, possible scenarios regarding the introduction of high-NA EUV lithography at the 2 nm node are explored, showing promising results from both a cost and a yield perspective.