Texture and cleaning medium for surface treatment of wafers and their use

The invention relates to a liquid medium for the surface treatment of monocrystalline wafers, which contains an alkaline etchant and at least one sparingly volatile organic compound. Such systems can be used to clean, damage, and texturize wafer surfaces in a single etch step, as well as exclusively for texturing silicon wafers of varying surface quality, whether wire-sawn high surface area wafers or chemically polished, minimum damage density wafers.