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Interconnect and packaging technologies for terahertz frequencies
Interconnect and packaging technologies for terahertz frequencies
2017
Goutam Chattopadhyay
T. Reck
Cecile Jung-Kubiak
Maria Alonso-delPino
Choonsup Lee
Keywords:
Deep reactive-ion etching
Preprint
Materials science
Interconnection
Surface micromachining
Optoelectronics
Terahertz radiation
Correction
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