Means having integrated power supply

2013 
This article relates to a device having a integrated power supply, disclosed is a method for forming a semiconductor device and a semiconductor device. The semiconductor device comprises a die. A substrate comprising a die having a first die and the second major surface. Power module below the second major surface of the semiconductor device includes a substrate disposed grains. The power module is electrically coupled through a silicon crystal grains in the perforated contacts.
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