Advanced High Density Trench Capacitor Substrate Technology for 3D heterogeneous stacks with outstanding performances.

3D technology using TSV interconnect is an option that is enabling various heterogeneous integrations , bringing more functionalities by stacking different types of devices , performance enhancement and miniaturization .This paper will cover IPDiA's latest product developments in the medical and power management domains .Several examples with high density trench capacitor substrate technology connected in a 3D heterogeneous stack using TSV with active dies such as microcontroller , crystal, or sensor will be illustrated. This technology is getting more and more mature and a few players are now able to bring such products to the market but the industry is still struggling with challenges .Some of them such as wafer bonding , wafer testing and packaging will be depicted in this paper .