Method of manufacturing a semiconductor device, and semiconductor manufacturing device

Method of manufacturing a semiconductor device, The semiconductor chip 1, and the bump forming step of forming a bump electrode 100 which protrudes in a substantially conical shape, The substrate 10, and the pad forming step of the inner surface to form a pad electrode 200 having a recess 210 in a substantially pyramidal shape or prismatic shape, The bump electrode 100 in a state of being inserted into the recess 210, the pressure for pressurizing in a direction to approach the bump electrode 100 and the pad electrode 200 to each other, a state in which the center axis made to coincide the center axis and recess 210 of the bump electrode 100 and a step, At least one of the bump electrodes 100 and pad electrodes 200 to vibrate ultrasonically with a, an ultrasonic bonding process for bonding the bump electrode 100 and the pad electrode 200.