Anisotropic conductive film and semiconductor device using the same
2013
The present invention, while the viscosity of the conductive layer is adjusted higher than the viscosity of the insulating layer are electrically connected Excellent adhesive strength is also directed to a superior anisotropic conductive film. More specifically, the present invention is a conductive particle and poly silse comprises a conductive layer and an insulating layer containing a ski dioxane, the minimum melt viscosity of the conductive layer is greater than the minimum melt viscosity of the insulating layer, duplex anisotropic conductive film, and this, using It relates to a semiconductor device connected to.
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