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S-band Tx Module with Cu Pillar Interconnection Si/GaN 3D Chip Embedding Substrate
S-band Tx Module with Cu Pillar Interconnection Si/GaN 3D Chip Embedding Substrate
2018
Kawasaki Kengo
Kuwata Eigo
Ishibashi Hidenori
Yao Tomohiro
Ishida Kiyoshi
Maeda Kazuhiro
Shibata Hironobu
Tsuru Masaomi
Mori Kazutomi
Shimozawa Mitsuhiro
Fukumoto Hiroshi
Keywords:
Pillar
Embedding
Substrate (chemistry)
S band
Electronic engineering
Three-dimensional integrated circuit
Interconnection
Monolithic microwave integrated circuit
Materials science
Optoelectronics
Correction
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