Support jig for semiconductor wafers

PROBLEM TO BE SOLVED: To provide a support tool for a semiconductor wafer that reduces in weight and improve in productivity by sweeping away a risk of deformation of a holding frame when the holding frame is used for a heating process. SOLUTION: The support tool detachably holds a peripheral edge of a heat-resisting elastomer layer 3 holding the semiconductor wafer W, between an inner holding frame 1 and an outer holding frame 2 engaging each other, and is used at least for the heating processing. In the support tool, the inner holding frame 1 and outer holding frame 2 are respectively injection-molded using resin-containing molded materials having a load bending temperature of ≥300°C in ASTM D648 of the ASTM standards and a bending strength of ≥120 MPa in ASTM D790. COPYRIGHT: (C)2011,JPO&INPIT