Terahertz Band Interconnect Architecture for Future Chip-to-Chip Wireless Communication

This paper introduces a new wireless chip-to-chip interconnection architecture based on two Vivaldi antennas operating at terahertz (THz) frequency range (250–300 GHz). Preliminary simulation results show that the free space transmission levels over a distance of d=5 mm are around −25 dB. In order to improve these values, we propose to modify the propagation channel characteristic by inserting a metallic strips array printed on thin dielectric substrate, utilizing this technique the transmission levels are remarkably improved to −6 dB over a large bandwidth (250 – 300 GHz) which is 19 dB enhancement.