Probe card, and a method of manufacturing the same.

The probe card 1, the wafer-side plunger 51 at one end, a plurality of probe pins 50 having a substrate side plunger 52 at the other end, a plurality of probe pins 50 Together but are arranged corresponding to the arrangement of the external terminals of the semiconductor wafer, as the wafer side plunger 51 of the probe pin 50 is 臨出, the two upper and lower probe guide 30, 40 for supporting a plurality of probe pins 50, a printed circuit board 10 having a pad 13 in which the substrate side plunger 52 of the probe pin 50 which is supported by the probe guide 30, 40 are in contact, it constitutes a reinforcing member 20. provided on the back surface of the printed circuit board 10. Then, to prepare a probe guide 30, 40 of a material having a thermal expansion coefficient substantially the same coefficient of thermal expansion of the semiconductor wafer, a probe guide 30, 40 to the printed circuit board 10 and the reinforcing member 20 at its peripheral portion and the central portion fixed. Such a probe card 1 having the structure can be maintained high needle position precision of the probe pins 50 with the pads 13 of the external terminals and the printed circuit board 10 of the semiconductor wafer.