Reliability investigation of Via-bridges for flexible electronics

In this paper we have carried out investigation of reliability of Via-bridge under mechanical bending for application in flexible electronics. Progresses in the flexible electronics field unlocked the fabrication of next-generation devices such as foldable mobile phones, wearables [1] , electronic skin (e-skin) [2] - [4] , textile electronics [5] , flexible energy harvesting/storage [2] , [5] and flexible memory devices [6] , [7] .