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Delamination Reliability Evaluation Analysis in Thermal Cycle Test of Encapsulation Resins for Power Devices
Delamination Reliability Evaluation Analysis in Thermal Cycle Test of Encapsulation Resins for Power Devices
2019
Takeshi Kakara
Hiroshi Nakaido
Takuya Hatao
Genki Nagao
Masaaki Koganemaru
Toru Ikeda
Keywords:
thermal cycle test
Power semiconductor device
Encapsulation (computer programming)
Delamination
Materials science
Composite material
Correction
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